NVIDIA B200 192GB Blackwell
Revolutionary Blackwell architecture with 192GB HBM3e and FP4 precision for next-gen AI. Pre-order now for 2025 delivery - reserve your allocation with our sales team.
Price Available Upon Request
Contact us for custom pricing and availability
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Price Available Upon Request
This cutting-edge product requires custom configuration and pricing. Contact our team for availability and quotes.
Or call us at (850) 407-7265
What it's for
The NVIDIA B200 Tensor Core GPU represents a revolutionary leap in AI computing with the new Blackwell architecture. Featuring 208 billion transistors and a dual-die chiplet design, the B200 delivers 20 petaFLOPS of FP4 AI compute—5x more than H100. With 192GB of ultra-fast HBM3e memory and 8TB/s bandwidth, it's engineered to handle the most demanding foundation models and trillion-parameter AI workloads. Secure your Blackwell allocation today. Limited early access slots available for Q2 2025 delivery. Contact our enterprise team at (555) 123-4567 for priority ordering and deployment planning.
Key Features
- ✓208 billion transistors in dual-die chiplet design - 2.6x more than H100
- ✓20 petaFLOPS FP4 performance - 5x faster than H100 for AI
- ✓192GB HBM3e memory with 8TB/s bandwidth
- ✓Second-generation Transformer Engine with FP4 arithmetic
- ✓Advanced NVLink with 1.8TB/s bi-directional throughput
- ✓TSMC N4P process node for maximum efficiency
- ✓Fifth-generation Tensor Cores with multi-precision support
- ✓Designed for trillion-parameter model training and inference
Use Cases
- →Foundation model training (GPT-4 scale and beyond)
- →Trillion-parameter AI model development
- →Real-time generative AI inference at scale
- →Multi-modal AI (text, image, video, audio)
- →Scientific computing and simulation
- →Drug discovery and genomics research
Technical Specifications
| Architecture | Blackwell (5th Gen) |
| GPU Memory | 192 GB HBM3e |
| Memory Bandwidth | 8 TB/s |
| Transistor Count | 208 billion |
| FP4 Performance | 20 petaFLOPS (sparse) |
| FP8 Performance | ~10 petaFLOPS |
| FP16 Performance | ~5 petaFLOPS |
| Tensor Cores | 5th Generation |
| NVLink Bandwidth | 1.8 TB/s bi-directional |
| Process Node | TSMC N4P |
| Max TDP | 1000W |
| Thermal Solution | Liquid cooling required |
| Form Factor | NVL72 dual-die package |
| Die Configuration | Dual-chip module |
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